WIML at ISSCC 2026: Pioneering the Future of Wearable Stress Monitoring

In February 2026, our team traveled to the IEEE International Solid-State Circuits Conference (ISSCC)—often referred to as the “Chip Olympics”—to present our latest breakthrough in biomedical IC design. Psychological stress monitoring has become a critical challenge in modern health assessment, but existing commercial devices like smart rings often rely on limited data. At this year’s conference, we were proud to unveil a comprehensive, ultra-low-power solution designed right here in our lab. It was an incredible experience to share our work with the global solid-state circuits community, connect with fellow researchers, and represent National Yang Ming Chiao Tung University on the world stage.